DX517是一款專(zhuān)門(mén)為人眼安全打造的堆疊封裝遠(yuǎn)距離探測(cè)LiDAR芯片。其SPAD采用基于大芯半導(dǎo)體核心知識(shí)產(chǎn)權(quán)的銦鎵砷材料，可以在1550nm波段實(shí)現(xiàn)高探測(cè)效率。該芯片將銦鎵砷材料工藝的感光wafer和傳統(tǒng)硅工藝的Logic wafer進(jìn)行混合型堆疊封裝。該芯片可以使用在自動(dòng)駕駛汽車(chē)、無(wú)人機(jī)等各種遠(yuǎn)距離應(yīng)用。

• 1550nm InGaAs SPAD
• Hybrid 3D Stack
• 300m long distance detection
• 3D LiDAR technology with high sensitivity SPAD detection
• Delivers high SNR, wide dynamic range and no multi-path reflections
• 10um x 10 um BSI pixels
• 200 x600 SPAD Detection And Ranging pixels
• Fast on-chip histogram processing
• Sub-nanosecond light pulse
• Sunlight on-chip rejection filter and algorithm
• Programmable Repetition rate